High-Speed Interconnect

This image compares five major high-speed interconnect technologies:

NVLink (NVIDIA Link)

  • Speed: 900GB/s (NVLink 4.0)
  • Use Case: GPU core-to-HBM, AI/HPC with NVIDIA GPUs
  • Features: NVIDIA proprietary, dominates AI/HPC market
  • Maturity: Mature

CXL (Compute Express Link)

  • Speed: 128GB/s
  • Use Case: Memory pooling, data center, general data center memory
  • Features: Supported by Intel, AMD, NVIDIA, Samsung; PCIe-based with chip-to-chip focus
  • Maturity: Maturing

UALink (Ultra Accelerator Link)

  • Speed: 800GB/s (estimated, UALink 1.0)
  • Use Case: AI clusters, GPU/accelerator interconnect
  • Features: Led by AMD, Intel, Broadcom, Google; NVLink alternative
  • Maturity: Early (2025 launch)

UCIe (Universal Chiplet Interconnect Express)

  • Speed: 896GB/s (electrical), 7Tbps (optical, not yet available)
  • Use Case: Chiplet-based SoC, MCM (Multi-Chip Module)
  • Features: Supported by Intel, AMD, TSMC, NVIDIA; chiplet design focus
  • Maturity: Early stage, excellent performance with optical version

CCIX (Cache Coherent Interconnect for Accelerators)

  • Speed: 128GB/s (PCIe 5.0-based)
  • Use Case: ARM servers, accelerators
  • Features: Supported by ARM, AMD, Xilinx; ARM-based server focus
  • Maturity: Low, limited power efficiency

Summary: All technologies are converging toward higher bandwidth, lower latency, and chip-to-chip connectivity to address the growing demands of AI/HPC workloads. The effectiveness varies by ecosystem, with specialized solutions like NVLink leading in performance while universal standards like CXL focus on broader compatibility and adoption.

With Claude